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2 items found for: Wafer Grinding, Lapping & Polishing Description Category Manufacturer Model Part Price Disco DFG840 Disco DFG840 Automatic Wafer Back Grinder (4",5",6",8", 100mm, 125mm, 150mm, 200mm), 1 set @U$70,000.00 per system Located in Korea Wafer Grinding, Lapping & Polishing Disco DFG840 70000 WANTED: Disco DFG8560 any vintage, good condition, available machine, Please let me know soon. Wafer Grinding, Lapping & Polishing Disco DFG8560 Copyright 2008 wSemi.com - All Rights Reserved.